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 PD 6.092
PRELIMINARY
IRPT1053A
POWIRTRAINTM Power Module for 1 hp Motor Drives
* 1 hp (0.75kW) power output Industrial rating at 150% overload for 1 minute * 180 - 240V AC input, 50/60Hz * 3-phase rectifier bridge * 3-phase ultrafast IGBT inverter * HEXFRED ultrafast soft recovery freewheeling diodes * Low inductance (current sense) shunts in positive and negative DC rail * NTC temperature sensor * Pin-to-base plate isolation 2500V rms * Easy-to-mount two-screw package * Case temperature range -25C to 125C operational
Figure 1. IRPT1053A Power Module
180-240V 3-phase input
IRPT1053A
Power Module
PWM variable frequency output
IRPT1053D
Driver-Plus Board
AC motor
POWIRTRAIN
feedback (non-isolated)
PWM generator
feedback processing
keyboard
External Control Functions Figure 2. The IRPT1053C POWIRTRAIN within a motor control system
Revised 3/97
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page 1
IRPT1053A
The IRPT1053A Power Module
The IRPT1053A Power Module, shown in figure 1, is a chip and wire epoxy encapsulated module. It houses input rectifiers output inverter, current sense shunts and NTC thermistor. The 3phase input bridge rectifiers are rated at 800V. The inverter section employs 600V, short circuit rated, ultrafast IGBTs and ultrafast freewheeling diodes. Current sensing is achieved through 45m low inductance shunts provided in the positive and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module meets UL840 pollution level 3 requirements. The power circuit and layout within the module are carefully designed to minimize inductance in the power path, to reduce noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be soldered to the power module pins, thus minimizing assembly and alignment. The power module is designed to be mounted to a heat sink with two screw mount positions, in order to insure good thermal contact between the module substrate and the heat sink.
PowIRtrain and Design Kit
The IRPT1053A PowIRtrain (Figure 3) provides the complete power conversion function for a 1hp (0.75kW) variable voltage, variable frequency AC motor controller. The PowIRtrain combines the Power Module (IRPT1053A) with a Driver-Plus Board (IRPT1053D). The PowIRtrain Design Kit, IRPT1053E includes the following:
* * * * * * *
Complete PowIRtrain integrated power stage Specification and operating instructions Bill of materials Electrical schematic Mechanical layout for Driver-Plus Board Software transferrable files for easy design integration Application information and layout considerations
Figure 3. IRPT1053C PowIRtrain
page 2
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IRPT1053A
Specifications
PARAMETERS Input Power
Voltage Frequency Current IFSM
VALUES
220V, -15%, +10%, 3-phase 50 - 60Hz 6.2 Arms @ nominal output 175 A 0 - 230V rms 1hp (0.75kW) nominal full load power 150% overload for 1 minute 4.4A nominal full load current 6.6A 150% overload for 1 minute
CONDITIONS
TA = 40C, RthSA = 1.07C/W 10ms half-cycle, non-repetitive surge defined by external PWM control Vin = 220V, fpwm = 4kHz, fo = 60Hz TA = 40C, RthSA = 1.07C/W
Output Power
Voltage Nominal motor hp (kW) Nominal motor current
DC Link
DC link voltage 425V maximum 50kOhms 5% 3.1kOhms 10% 45mOhms 5% 10s 30A peak 39 nC (typical) IR2132J (see figure 10) 2500V rms -25C to 125C 1 Nm -40C to 125C at the pins (.06" from case) VGE = 15V refer Figure 5b refer design kit IRPT1053E pin to base plate, 60Hz, 1 minute 95%RH max. (non-condensing) M4 screw type @ TNTC = 25C @ TNTC = 100C @ TSHUNT = 25C DC bus = 425V, VGE = 15V, line to line short
Sensor
Temp. sense resistance Current sense
Protection
IGBT short circuit time Recommended short circuitshutdown current
Gate Drive
QG Recommended gate driver
Module
Isolation voltage Operating case temperature Mounting torque Storage temp. range
Soldering temperature for 10 sec. 260C maximum
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page 3
IRPT1053A
1.4
100
Thermal Resistance (RthSAC/ W)
1.2
RthSA 100% load continuous 10-60 Hz RthSA 150% load (1 min) 10-60 Hz
80 70 60 50
1
0.8
Power 150%
0.6
40
0.4
Power 100%
1.0hp (0.75kW)
RthSA 150% load (1 min) down to 3 Hz
30 20 10
0.2
0 1 4 8 12 16 PWM Frequency (kHz) - (Induction Motor Load) 20 24
0
Figure 4a. 1hp/4.4A output Heat sink Thermal Resistance and Power Dissipation vs. PWM Frequency
1.8 80 70 1.6
Thermal Resistance (RthSAC/ W)
1.4
RthSA 100% load continuous 10-60 Hz
60 50
1.2
Power 150%
RthSA 150% load (1 min) 10-60 Hz
40 30 20 10 0
1
Power 100%
0.8
RthSA 150% load (1 min) down to 3 Hz
0.75hp (0.55kW)
0.6 1 4 8 12 16 PWM Frequency (kHz) - (Induction Motor Load) 20 24
Figure 4b. 0.75hp/3.5A output Heat sink Thermal Resistance and Power Dissipation vs. PWM Frequency
NOTE: For figures 4a and 4b - Operating Conditions: Vin = 230 Vrms, MI = 1.15, P.F. = 0.8, TA = 40C. ZthSA limits Tc rise during 1 minute overload to 10C.
page 4 www.irf.com
Total Power Dissipation (Watts)
Total Power Dissipation (Watts)
90
IRPT1053A
1400 20
1200
V G E , G a te -to -E m itte r V olta ge (V )
V GE = C ie s = C re s = C oes =
0V , f = 1M H z C g e + C g c , C c e S H O R TE D C gc C ce + C gc
V C E = 4 0 0V IC = 14A
16
C , C a pa cita n ce (pF )
1000
C ie s
800
12
C oes
600
8
400
4
200
C re s
A
1 10 100
0
0 0 10 20 30
A
40
V C E , C o lle cto r-to -E m itte r V o lta g e (V )
Q g , To tal G a te C h a rge (n C )
Figure 5a - Typical Capacitance vs. Collector-to-Emitter Voltage
Figure 5b - Typical Gate Charge vs. Gate-to-Emitter Voltage
100
I C , C o llecto r-to -E m itte r C u rre nt (A )
50,000 40,000 30,000 20,000 10,000 0 25 31 37 43 49 55 61 67 73 79 85 91 97 103 109
TJ = 1 5 0 C
10
TJ = 2 5 C
Resistance (ohms)
Temperature (deg.C)
1 5 10
V CC = 100V 5 s P U L S E W ID T H A
15 20
VG E , G a te -to -E m itte r V o lta g e (V )
Figure 5c - Typical Transfer Characteristics
Figure 6 - Normal R-T Characteristics of the NTC Thermistor
page 5
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IRPT1053A
Mounting Procedure
Mounting
1. Connect the driver board and the IRPT1053A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat sink flatners is .001 inch/ inch and Total Indicator Readout (TIR) of .003 inch below substrate 4. Place the power substrate onto the heat sink with the mounting holes aligned and press it firmly into the silicone grease. 5. Place the 2 M4 mounting screws through the PCB and power module and into the heat sink and tighten the screws to 1 Nm torque.
Functional Information
Heat Sink Requirements
Figures 4a-4b show the thermal resistance of the heat sink required for various output power levels and PulseWidth-Modulated (PWM) switching frequencies. Maximum total losses of the unit are also shown. This data is based on the following key operating conditions: * The maximum continuous combined losses of the rectifier and inverter occur at full pulse-width-modulation. These maximum losses set the maximum continuous operating temperature of the heat sink. * The maximum combined losses of the rectifier and inverter at full pulse-width-modulation under overload set the incremental temperature rise of the heat sink during overload. * The minimum output frequency at which full load current is to be delivered sets the peak IGBT junction temperature. * At low output frequency, IGBT junction temperature tends to follow the instantaneous fluctuations of the output current. Thus, peak junction temperature rise increases as output frequency decreases.
Figure 6. Power Module Mounting Screw Sequence
Power Connections
The power module pin designation, function and other details can be obtained from the package outline in Figure 8 and circuit diagram in Figure 9. Three phase input connections made to pins R, S and T and inverter output connections are made to pins U, V and W. Positive rectifier output and positive inverter bus are brought out to pins RP and P respectively in order to provide DC bus capacitor soft charging implementation option. The current shunt terminals are connected to pins ISI, IS2 and IS3, IS4 on the positive and negative DC rail respectively.
page 6
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1
2
Over Temperature Protection
Over temperature can be detected using the NTC thermistor included in the power module for thermal sensing. Protection circuit that initiates a shutdown if the temperature of the IMS substrate exceeds a set level can be implemented. The nominal resistance vs. temperature characteristic of the thermistor is given in Figure 6.
Voltage Rise During Braking
The motor will feed energy back to the DC link during regenerative braking, forcing the DC bus voltage to rise above the level defined by input line voltage. Deceleration of the motor must be controlled by appropriate PWM control to keep the DC bus voltage within the rated maximum value.
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IRPT1053A
IRPT1053A Mechanical Specifications
NOTE: Dimensions are in inches [milliimeters]
2.600 [66.04] 2.282 [57.96] 28X .032 [0.81] .650 [16.51]
.020 [0.51] THICKNESS
RP
E1 G1
E3 G3
E5 G5
N
RT1 RT2 N/C
P IS1 IS2
2X R .210 [5.33] 2X R .080 [2.03]
1.770 [44.96]
1.419 [36.04]
1.750 [44.45]
E4 G4 E6 G6 N/C
IS4 IS3 E2 G2
R
S
2.265 [57.53] .307 [7.80]
W
U
V
T
.209 [5.31]
Figure 7.
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page 7
IRPT1053A
IRPT1053A Mechanical Specifications
NOTE: Dimensions are in inches [milliimeters]
1.050 [26.67] .850 [21.59]
IRPT1053A
.750 [19.05]
.550 [13.97] .450 [11.43]
.875 [22.23] PIN CENTER
.000 [ 0.00]
PIN CENTER .875 [22.23]
.450 [11.43] .550 [13.97]
.150 [ 3.81] .050 [ 1.27]
.150 [ 3.81] .250 [ 6.35]
.950 [24.13]
ALL PIN COORDINATE DIMENSIONS ARE BASIC
1.050 [26.67]
.650 [16.51]
.650 [16.51]
.350 [ 8.89] .250 [ 6.35] .000 [ 0.00] .050 [ 1.27]
.850 [21.59]
PIN DIAGONAL .037 - .034 [.940 - .864] 28X .010
M
A
28X ( .026 - .024) 28X .040 [1.02]
MOUNTING SURFACE IN CLAMPED CONDITION A
Figure 8.
page 8
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IRPT1053A
Figure 9. Power Module Circuit Diagram
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page 9
IRPT1053A
Figure 10. Recommended Gate Drive Circuit
page 10
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IRPT1053A
Part Number Identification and Ordering Instructions
IRPT1053A Power Module
Chip and wire epoxy encapsulated module with 800V rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with ultra-fast freewheeling diodes, temperature sensing NTC thermistor and current-sensing low-inductance shunts.
IRPT1053D Driver-Plus Board
Printed Circuit board assembled with DC link capacitors, NTC in-rush limiting thermistor, high-power terminal blocks, surge suppression MOVs, IGBT gate drivers, protection circuitry and low power supply. The PCB is functionally tested with standard power module to meet all system specifications.
IRPT1053C POWIRTRAIN
Integrated Power Module (IRPT1053A) and Driver-Plus Board (IRPT1053D) pre-assembled and tested to meet all system specifications.
IRPT1053E Design Kit
Complete POWIRTRAIN (IRPT1053C) with full set of design documentation including schematic diagram, bill of material, mechanical layoutof Driver Board, schematic files, Gerber files and design tips.
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page 11
IRPT1053A
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: 171 (K&H Bldg.), 30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 3/97
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